2013光互連的機遇 市場和技術預測第二卷

        中文：《光互連的機遇：市場和技術預測--2013-2020》（第二卷：On-Chip和Chip-to-Chip）
        英文：Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013-2020（Volume II: On-Chip and Chip-to-Chip）
發(fā)布時間：2013年7月

        報告簡介

        近年來，關于集成電路（IC）制造的傳統(tǒng)架構和材料方面的假設受到挑戰(zhàn)，半導體行業(yè)則正在尋找新的解決方案。此外，半導體行業(yè)的能源和散熱問題使得這一危機更加凸顯。

        其中最重要的問題之一就是所謂的“互連瓶頸”，即On-Chip和Chip-to-Chip都會同時出現(xiàn)的數(shù)據(jù)流量堵塞趨勢?；ミB瓶頸在摩爾定律完全失去動力的很久以前就已經出現(xiàn)，它現(xiàn)在是以不同的形式重新出現(xiàn)在為使芯片封裝更容易的新的架構中。

        “明顯的”解決方案是采用光學這一解決帶寬問題常用的方式。但是針對On-Chip和Chip-to-Chip互連的光學解決方案在商用產品的開發(fā)方面比較困難。生產能被用在芯片層級的足夠小和低廉的光子器件是一個很大的難題。

        在這份報告中，CIR分析了光互連在芯片層級的最新發(fā)展以及世界各地的重要研究小組在這個領域取得的進展。報告同時討論了研發(fā)和商用方面的進展。該報告從傳統(tǒng)CPU芯片以及最新架構的角度來看待這個問題，同時還分析了相對于金屬互連和未來可能出現(xiàn)的其它比光子更奇特的替代解決方案（尤其是碳納米管）而言，光互連所存在的發(fā)展機遇。

        報告里面還包括了未來十年的演進路線圖。該路線圖展示了芯片層級光互連商業(yè)機會的出現(xiàn)時機、應用領域及其市場規(guī)模。CIR還分析了領導廠商及其在設計和實施On-Chip & Chip-to-Chip光互連方面的研究工作。

        參考目錄

        Executive Summary
        執(zhí)行者摘要

E.1 Opportunities and Business Models for Photonics Firms
E.2 How the Semiconductor Industry Will Use Optical Interconnection as an Enabling
Technology
E.3 Summary of Key R&D Directions for On-Chip and Chip-to-Chip Optical Interconnection
E.4 Eight Companies and Other Organization that Will Create Photonic Interconnection for
Chip-Level Interconnection
E.5 Roadmap and Summary 10-year Forecast for Chip Level Interconnection

Chapter One: Introduction
第一章：報告簡介
1.1 Background to this Report
1.2 Objective and Scope of this Report
1.3 Methodology of this Report
1.4 Plan of this Report

Chapter Two: Analysis of Demand for On-Chip/Chip-to-Chip Interconnection
第二章：On-Chip & Chip-to-Chip互連需求分析
2.1 Limits to Electronic Interconnects
2.2 Moore’s Law, Scaling and Interconnection
2.2.1 Current Prognosis for Moore’s Law
2.2.2 Impact on Interconnection
2.3 Multi-Core Processors Breed New Interconnection Problems
2.4 So Do 3D Chips
2.5 Potential for Moving to Non-Silicon Chips: Carbon Nanotubes, Graphene, Quantum Dots
2.5.1 Impact on Interconnection
2.6 A Possible Transition to Optical Computing
2.6.1 Impact on Interconnection
2.7 Key Points Made in this Chapter

Chapter Three Technologies for On-Chip/Chip-to-Chip Interconnection
第三章：On-Chip & Chip-to-Chip互連的三種技術
3.1 Current Optical Assemblies for Chip-to-Chip Interconnection
3.2 Emerging Laser Technology for Chip-Based Interconnections
3.2.1 VCSELs
3.2.2 Quantum Dot Lasers
3.2.3 Other Technologies
3.3 Emerging Detector Technology for Chip-Based Interconnection
3.4 Emerging Modulator Technology for Chip-Based Interconnection
3.5 Ten-Year Road Map and Revenue Forecast for Chip-Based Optical Interconnection
3.6 The Role of Optical Integration in Future Chip-Based Interconnection
3.6.1 Silicon Photonics
3.6.2 Indium Phosphide and Other Inorganic Semiconductors
3.6.3 The Role of Polymer Waveguides in Chip-Based Interconnection
3.6.4 Ten-Year Road Map and Revenue Forecast for Optical Integration in Chip-Based Optical
Interconnection
3.7 Other Alternatives to Optics for Advanced Interconnection
3.7.1 Carbon Nanotubes
3.7.2 Other
3.8 Key Points Made in this Chapter

    附：《光互連的機遇：市場和技術預測--2013-2020》（第一卷：板對板和機架到機架）